Technical Support Engineer (Package Substrate)
| Job Title: | Technical Support Engineer (Package Substrate) |
| Our Client: | A Leading Innovative Technologies Company |
| Country: | United States |
| Location: | Cupertino, CA |
| Specialisation: | Manufacturing & Engineering |
| Salary: | $100,000-$200,000 |
| Job Reference: | 16422 |
| Contact Person: | Leah SHI Managing Consultant |
| Contact Email: | leah.shi@cesna.com |
| Job Published: | 2026-10-29 |
Position
Technical Support Engineer (Package Substrate)
About Our Client
Job Summary
Serve as the on-site technical lead for advanced package substrate programs with Apple in the U.S., driving issue resolution and alignment with our teams in Korea to deliver successful mass production launches.
Job Description
- 1) Main Responsibilities
- - Provide technical support for customer development programs (Mobile AiP, SiP, FC-CSP, RF).
- - Resolve technical issues and drive performance stabilization at the customer.
- - Identify and develop PoC opportunities through customer engagement.
- - Guide BOM and substrate structure selection using LGIT technical solutions.
- - Lead design reviews, TRA assessments, yield improvement, and production readiness.
- - Coordinate between customer engineering and LGIT R&D, Process, Quality, and Manufacturing.
- 2) Others
- - Conduct regular customer meetings and technical presentations.
- - Collect customer VOC and market intelligence to shape technology roadmaps.
- - Support technology promotions, exhibitions, and strategic customer engagements.
- - Promote advanced substrate technologies (Hybrid Stack-up, Fine Pattern, Cavity, Hyper Flex).
Qualifications
- - Bachelor's degree or higher in Engineering, Materials Science, Chemistry, or a related field.
- - Bilingual in both English and Korean
- - - 10+ years in package substrate development, process or customer engineering, or technical marketing.
- - Proven record of leading substrate projects through mass production.
- - Experience supporting major semiconductor customers preferred.
- - Deep knowledge of substrate processes, materials, structures, and design rules.
- - Hands-on experience with ABF, ETS, Hybrid Stack-up, Cavity, Fine Pattern, and RF.
- - Ability to translate customer requirements into technical solutions.
- - Experience in NPI, yield improvement, and production transfer.
- - Strong customer relationship management skills.
- - Clear technical presentation and communication skills.
- - Project management and problem-solving capability.
- - MS Office (PowerPoint, Excel, Word).
- - Six Sigma Green Belt or equivalent preferred.
- - PMP or equivalent project management certification preferred.
- Travel:
- - On-site customer support with frequent customer engagement.
- - Frequent travel to customer sites within the U.S.
- - Periodic travel to Korea for engineering and business reviews.
What's On Offer
Apply online or feel free to contact us directly for more information about the opportunity. Due to the high volume of applicant, we regret to inform that only shortlisted candidates will be notified. Thank you for your understanding.
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